1. What Is the Skin Effect?
An alternating current sets up a changing magnetic field inside its own conductor. That field induces eddy currents that oppose the current in the centre and reinforce it near the surface, so the current crowds into a thin layer at the skin. The higher the frequency, the conductivity and the permeability, the thinner the layer.
The same physics describes a wave arriving at a metal surface: the field that enters the metal decays exponentially, and the energy it carries is turned into heat. The skin depth δ is the depth at which the amplitude has fallen to 1/e, about 37 % of its surface value.
2. Skin Depth of a Good Conductor
When the conduction current is much larger than the displacement current (σ ≫ ωε, true for all metals well into the terahertz range), the diffusion equation gives:
Skin depth, good conductor
f in Hz · μ0 = 4π × 10⁻⁷ H/m · σ in S/m · copper: δ ≈ 66 µm / √(f in MHz)
Halving δ takes four times the frequency. Inside the conductor the wavelength is λc = 2πδ and the phase velocity vp = ωδ, a few metres per second for copper at power frequencies.
3. Any Lossy Medium
For seawater, soil or semiconductors the displacement current cannot be ignored. The calculator then uses the complex propagation constant directly:
Propagation constant and exact skin depth
ε = ε0εr · reduces to section 2 when σ/ωε ≫ 1
The ratio σ/ωε decides the regime. Above about 100 the good-conductor formula is within 1 %; near 1 the medium is a lossy dielectric and δ stops falling with frequency, tending to (2/σ)√(ε/μ).
4. Surface Impedance and Surface Resistance
The ratio of tangential E to tangential H at the surface of a thick conductor is its surface impedance. Its real part is the surface resistance, which multiplies the square of the surface current to give the loss per unit area:
Surface impedance
Ω per square · Js = surface current density in A/m (peak) · copper at 1 GHz: Rs ≈ 8.25 mΩ
Rs is the DC resistance of a slab of the same conductor exactly one skin depth thick. The surface reactance Xs equals Rs for a good conductor and adds a small internal inductance.
5. Current Density in Depth
In a thick plane conductor the current density decays and rotates in phase with depth z:
Current distribution
amplitude falls 8.69 dB per skin depth · phase lags 57.3° per skin depth
A foil of thickness t carrying current on one face has Zs = Z coth(γt); with current on both faces, as in an isolated strip, each face sees a half-thickness with Z coth(γt/2). When t ≪ δ both reduce to the DC sheet resistance 1/(σt).
6. Plated and Layered Conductors
Each layer acts as a short lossy transmission line terminated by the surface impedance of what lies beneath. Starting at the thick base Zb and working up to the surface:
Surface impedance of a layer over a load
Zk, γk = intrinsic impedance and propagation constant of layer k · ZL = surface impedance below it
The magnetic field falls through each layer by 1/[cosh(γt) + (ZL/Zk)sinh(γt)], and the loss in a layer is the difference between the power entering its top and leaving its bottom, Re(Z)|H|²/2 at each interface. This is how the share of loss by layer is found. A poor conductor under a good one, such as nickel under gold in ENIG, raises the loss most when its thickness is near one or two of its own skin depths.
7. Round Wire — the Exact Solution
In a round wire of radius a the current density follows a Bessel function of complex argument. Writing it with the Kelvin functions ber and bei of x = √2·a/δ:
AC resistance and internal inductance
Rdc = ℓ/(σπa²) · Li,dc = μℓ/(8π), 50 nH/m for a non-magnetic wire
The calculator sums the power series of ber and bei up to x = 20 and uses the asymptotic forms beyond, where Rac/Rdc ≈ ξ/2 + 1/4 + 3/(32ξ) and ωLi/Rdc ≈ ξ/2 − 3/(32ξ), with ξ = a/δ. At low frequency Rac/Rdc ≈ 1 + x⁴/192, so the resistance doubles at a ≈ 3.45δ.
8. Rectangular Traces
There is no closed-form solution for a rectangle. The calculator uses the common perimeter model, in which the current fills a band one skin depth deep around the edge:
Effective area of a w × t trace
tends to Rsℓ/(2(w + t)) at high frequency and to Rdc at low frequency
The conductor attenuation of a line of impedance Z0 is then αc ≈ R′/(2Z0) Np/m, or 8.686·R′/(2Z0) dB/m, with R′ the resistance per metre. For a microstrip the current also flows in the ground plane and crowds toward it, so this is a lower bound.
9. Surface Roughness
Copper foil is roughened to bond to the laminate. When δ approaches the RMS roughness Rq the current follows the teeth and the path lengthens. Two widely used correction factors multiply the smooth-conductor resistance:
Roughness correction
Hammerstad–Jensen (1980) · Groisse et al. (1996) · both tend to 2
Laminate makers quote Rz or Ra more often than Rq; for typical foil profiles Rq is roughly 1.1–1.25 × Ra and well below Rz.
10. Temperature and Magnetic Metals
Conductivity is corrected linearly from its 20 °C value, σ(T) = σ20/[1 + α(T − 20)], so δ and Rs each change by about half of α per kelvin. Ferromagnetic metals (iron, nickel, carbon steel) have large μr at low frequency, which shrinks δ and raises Rs by √μr. Their permeability falls with frequency, collapsing toward 1 above ferromagnetic resonance in the gigahertz range, and depends on the field level and on DC bias, so enter an effective μr for your case.
11. Validity and Limitations
- The plane and wire results assume an isolated conductor. Proximity effect from nearby conductors, coil turns and ground planes raises the resistance further.
- Bulk conductivity is used. Thin films, plated and sputtered layers often have 10–50 % lower conductivity than the bulk metal.
- At very low temperature and very high frequency the anomalous skin effect limits how far Rs falls, as the electron mean free path exceeds δ.
- Ferromagnetic results depend strongly on the μr you enter.
References
- Ramo, S., Whinnery, J.R. and Van Duzer, T., Fields and Waves in Communication Electronics, 3rd ed., Wiley, 1994 (skin effect, Kelvin-function wire solution).
- Pozar, D.M., Microwave Engineering, 4th ed., Wiley, 2012 (surface resistance, conductor loss).
- Wheeler, H.A., “Formulas for the Skin Effect,” Proc. IRE, vol. 30, no. 9, pp. 412–424, 1942.
- Hammerstad, E. and Jensen, Ø., “Accurate Models for Microstrip Computer-Aided Design,” IEEE MTT-S Int. Microwave Symp. Digest, pp. 407–409, 1980.
- Groisse, S. et al., “Influence of the line characteristics on the transmission properties of microstrip lines,” Proc. 26th European Microwave Conf., 1996.
- Huray, P.G. et al., “Impact of Copper Surface Texture on Loss: A Model that Works,” DesignCon, 2010.
- Abramowitz, M. and Stegun, I.A., Handbook of Mathematical Functions, §9.9–9.10, Kelvin functions, 1964.
- IEC 60028, International standard of resistance for copper (100 % IACS = 58.0 MS/m at 20 °C).
- CRC Handbook of Chemistry and Physics, Electrical Resistivity of Pure Metals.